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CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
Solder reflow
250
200
150
100
50
0
? Recommended reflow methods: IR, vapor phase oven, hot air oven.
? Devices are not designed to be wave soldered to the bottom side of the
board.
? Gluing the devices is not recommended.
? Recommended maximum paste thickness is 0.25 mm (.010 inch).
? Devices can be cleaned using standard industry methods and solvents.
Note:
? If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
160–220
10–20
120
? A device should not be reworked.
Time (seconds)
Product Dimensions
CMF-SDP07, 10, 25, 35, 50 & 75
CMF-SDP10A, 25A, 35A & 50A
8.75
(.344) MAX.
11.5
(.453)
MAX.
10.2
(402)
MAX.
9.0
(.354)
MAX.
2.6
(.102)
5.0
(.197)
11.0
(.433)
MAX.
2.4
(.094)
3.9
(.154)
0.5
(.020)
2 PLCS.
7.2
(.283)
MAX.
Recommended Pad Layout
9.0
(.354)
Recommended Pad Layout
MAX.
7.2
(.283)
MAX.
7.6
11.0
(.433)
8.75
(.344)
3.9
6.3
(.248)
(.299)
5.0
(.197)
(.154)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
DIMENSIONS =
MM
(INCHES)
8.2
(.323)
3.2
(.126)
2.0
(.079)
2.4
(.094)
Packaging options: TAPE & REEL: 350 pcs. per reel
Packaging options: TAPE & REEL: 400 pcs. per reel
CMF-SDP SERIES, REV. C, 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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